EddyCus® TF map 5050SR - Non-contact Sheet Resistance, Metal Layer Thickness and Anisotropy Mapping Device

Ad­vant­ages

• Non-con­tact meas­ure­ment
• High-res­ol­u­tion meas­ure­ments with 1 mm pitch (0.25 to 10 mm is also avail­able)
• Meas­ure­ment is in­de­pend­ent from con­tact qual­ity in com­pas­sion to con­tact­ing meth­ods
• High-res­ol­u­tion ima­ging of con­duct­ive thin-films ex­pos­ing ma­ter­i­al and pro­cess in­homo­gen­eit­ies
• Char­ac­ter­iz­a­tion of covered con­duct­ive lay­ers and en­cap­su­lated sub­strates
• Nu­mer­ous soft­ware in­teg­rated ana­lys­is func­tions (his­to­gram, stand­ard de­vi­ation, line scans, single-point ana­lys­is etc.)
• Load­ing and reana­lyz­ing data sets
• Stor­age and ex­port of meas­ure­ment and map­ping data
• User-friendly PDF re­port­ing for sys­tem­at­ic doc­u­ment­a­tion

Ap­plic­a­tion

• Con­tact­less sheet res­ist­ance map­ping of thin films
• Uni­form­ity con­trol and ex­am­in­a­tion of lay­er ho­mo­gen­eity
• De­fecto­scopy and lay­er ana­lys­is
• Meas­ur­ing and map­ping of the thick­ness of metal­lic lay­ers
• Qual­ity con­trol, in­com­ing in­spec­tion, in­spec­tion of out­go­ing goods

Spe­cific­a­tion

• Meas­ur­ing range : 0.001 to 1000 ohms / sq (oth­er on re­quest)
• Sample sizes : 50 x 50 mm to 500 x 500 mm²

Pro­cesses

• De­pos­ition (sput­ter­ing, evap­or­a­tion , ALD, CVD, elec­tro­plat­ing, print­ing, cast­ing, etc.)
• Ab­la­tion (etch­ing, pol­ish­ing, laser, EDM etc.)
• Dop­ing
• An­neal­ing

Area of ap­plic­a­tion

• R & D and QA of con­duct­ive lay­ers and lay­er sys­tems
• Metal­lic lay­ers and met­al foils
• Photo­vol­ta­ic (Si and thin-film PV)
• Wafer metal­liz­a­tion
• Smart glass ap­plic­a­tions / elec­tro­chromic glass / dy­nam­ic glass / Smart Glass
• Ar­chi­tec­tur­al Glass ( LowE )
• Mir­ror and re­flect­ive coat­ings
• Elec­trodes in en­ergy stor­age
• Con­duct­ive pa­per and con­duct­ive tex­tiles
• De-icing and heat­ing ap­plic­a­tions
• Ca­pa­cit­or films
• Bat­tery elec­trodes
• Dis­plays, touch screens
• OLED & LED ap­plic­a­tions

Vari­ants

• Sheet res­ist­ance [Ohm / sq]
• Thick­ness of metal­lic lay­ers [nm, µm]
• An­iso­tropy Ima­ging

Ma­ter­i­als and lay­ers 

• Trans­par­ent con­duct­ive ox­ides (TCOs such as ITO, AZO, FTO, etc.)
• Thin met­al lay­ers (5 nm to 2 mm de­pend­ing on the con­duct­iv­ity)
• Doped semi­con­duct­ors (Sil­ic­on)
• Met­al meshes and met­al wire struc­tures (Sil­ver-nano-wires)
• Graphene, Graph­ite and car­bon nan­otubes (CNT)
• Con­duct­ive inks and lac­quers
• Oth­er con­duct­ive films

Soft­ware and device con­trol

• Very user-friendly soft­ware
• Easy-to-use stat­ist­ic­al ana­lys­is op­tions
• Vari­ous data ana­lys­is, data sav­ing and ex­port op­tions