EddyCus® TF map 5050SR - Non-contact Sheet Resistance, Metal Layer Thickness and Anisotropy Mapping Device
The EddyCus® TF map 5050SR is a non-contact mapping system for high-resolution imaging of the sheet resistance or correlated proprieties such as metal thickness for sampling areas of 50 x 50 mm (2 x 2 inch) up to 500 x 500 mm (20 x 20 inch). The bench-top device automatically measures at various measurements points, typically with a pitch in X and Y of 1 mm (40 mil) generating accurate mappings of street resistance or thickness across the entire sample area. The resulting high-resolution property images resulting from many thousands of measurement points, contains various information valuable for R&D and quality assurance.
Advantages
- Non-contact measurement
- High-resolution measurements with 1 mm pitch (0.25 to 10 mm is also available)
- Measurement is independent from contact quality in compassion to contacting methods
- High-resolution imaging of conductive thin-films exposing material and process inhomogeneities
- Characterization of covered conductive layers and encapsulated substrates
- Numerous software integrated analysis functions (histogram, standard deviation, line scans, single-point analysis etc.)
- Loading and reanalyzing data sets
- Storage and export of measurement and mapping data
- User-friendly PDF reporting for systematic documentation
Application
- Contactless sheet resistance mapping of thin films
- Uniformity control and examination of layer homogeneity
- Defectoscopy and layer analysis
- Measuring and mapping of the thickness of metallic layers
- Quality control, incoming inspection, inspection of outgoing goods
Specification
- Measuring range : 0.001 to 1000 ohms / sq (other on request)
- Sample sizes : 50 x 50 mm to 500 x 500 mm²
Processes
- Deposition (sputtering, evaporation , ALD, CVD, electroplating, printing, casting, etc.)
- Ablation (etching, polishing, laser, EDM etc.)
- Doping
- Annealing
Area of application
- R & D and QA of conductive layers and layer systems
- Metallic layers and metal foils
- Photovoltaic (Si and thin-film PV)
- Wafer metallization
- Smart glass applications / electrochromic glass / dynamic glass / Smart Glass
- Architectural Glass ( LowE )
- Mirror and reflective coatings
- Electrodes in energy storage
- Conductive paper and conductive textiles
- De-icing and heating applications
- Capacitor films
- Battery electrodes
- Displays, touch screens
- OLED & LED applications
Variants
- Sheet resistance [Ohm / sq]
- Thickness of metallic layers [nm, µm]
- Anisotropy Imaging
Materials and layers
- Transparent conductive oxides (TCOs such as ITO, AZO, FTO, etc.)
- Thin metal layers (5 nm to 2 mm depending on the conductivity)
- Doped semiconductors (Silicon)
- Metal meshes and metal wire structures (Silver-nano-wires)
- Graphene, Graphite and carbon nanotubes (CNT)
- Conductive inks and lacquers
- Other conductive films
Software and device control
- Very user-friendly software
- Easy-to-use statistical analysis options
- Various data analysis, data saving and export options
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