EddyCus® TF inline - Non-contact Sheet Resistance, Layer Thickness and Electrical Anisotropy Measurement Solutions for Process Control

The EddyCus TF inline series measures layer properties such as metal layer thickness, sheet resistance, emissivity, residual moisture or grammage in non-contact on various substrates. Relevant substrates are glass, foil, paper, wafer, plastic or ceramic. Monitoring is done by permanent measurement or by trigger events to obtain equidistant results in fast moving coating processes. Monitoring solutions can be implemented either in atmosphere or vacuum conditions. Processes using eddy current technology benefit from high samples rates. Measurement results can be provided for process control systems using customer´s software. Additionally SURAGUS offers the monitoring software EddyCus EC Control that visualizes, stores and analyses metrology data.

 
Non-contact Inline Sheet Resistance Measurement using Eddy Currents
Non-contact Inline Sheet Resistance Measurement for Solar Wafer

Advantages

  • Non-contact real time measurement
  • High measurement speed up to 1,000 measurements/ sec.
  • Fixed sensor installation or traversing sensor installation
  • Integration of 1 – 99 monitoring lanes per system
  • Process control at atmosphere or in vacuum
  • Measurements very close to the edge of the substrate are possible in many applications
  • Long term stability by temperature compensated measurements in changing environment
  • Large distances to the testing material (eg. gap of 60 mm / 2.4 inch)
  • Characterization of covered conductive layers or encapsulated substrates
  • Numerous software integrated analysis and statistic functions
  • Easy set up by EddyCus RampUp software incl. wizard for system calibration
  • Wear- free

Motivation for the Use of Inline Metrology

  • Process control and quality assurance
  • Process time optimization
  • Machine utilization
  • Material usage
  • Productivity
  • Product performance improvement (e.g. high transparency and low resistivity, good emissivity, good barrier properties)
  • Layer homogeneity especially across large substrates widths
  • Predictive maintenance

Sensor Types

  • EddyCus TF inline SR – Sheet resistance monitoring (incl. emissivity)
  • EddyCus TF inline MT – Metal thickness monitoring
  • EddyCus TF inline RM – Resistivity and conductivity monitoring
  • EddyCus TF inline HF – Residual moisture monitoring
  • EddyCus TF inline SR-A – Sheet resistance and electrical anisotropy monitoring

Measurement Ranges

  • Sheet resistance: 0.1 mOhm/sq up to 1 kOhm/sq
  • Metal thickness: 2 nm – 2 mm (depending material conductivity)
  • Resisitvity: 0.1 mOhm cm - 5 ohm cm
  • Residual moisture (measurement in wet layers by non-contact permittivity measurement)
  • Electrical anisotropy: 0.33 to 3 (higher on request)
  • Correlating properties
    • Grammage: 0.1 to 1,000 g/sqm
    • Emissivity: 0.005 to 0.2

Applications

  • Architectural glass (LowE)
  • Packaging materials
  • Displays and touch screens
  • Photovoltaics (Thin-film and c-Si)
  • Mirror coatings
  • Capacitors
  • OLEDs and LEDs
  • Smart glass
  • Metal layers and wafer metallization
  • De-icing and heating
  • Batteries and fuel cells
  • Coated paper and conductive textiles
  • Graphene layers
  • Antibacterial coatings

Setups

  • Inline R2R
  • Inline S2S
  • Cluster tools
  • Integration into handling areas
  • Transmission and reflection setups

Processes

  • Deposition (PVD, ALD, (PE)CVD, electroplating, printing, spraying etc.)
  • Ablation/ structuring (etching, polishing, laser etc.)
  • Doping/ Implantation
  • Tempering/ Annealing
  • Drying/ Heating

SURAGUS offers inline and offline testing systems to support the achievement of those goals.

Sensor Form Factors (All Measurement Types)

  • Sensor S (many options)
  • Sensor S - Semi-Vac (vacuum only)
  • Sensor M
  • Sensor XS
  • Customized forms (multi sensors)

Interfaces

  • TCP, UDP
  • Modbus
  • CSV, XML
  • Analog, digital
  • Profinet

Environment

  • Atmosphere
  • Vacuum
  • ATEX
  • High temperature version on request

Wiring Setups

  • Control cabinet mounting near sensor positions
  • Direct mouting tool mounting  near sensor positions
  • Full sensor integrated hardware
inline printed electronics.jpg
Photovoltaic_wafer_inline_tool_integrated.png
SURAGUS Sensor S horizontal mounting.jpg
Two outer sensors test on control line and inner sensor measure on complex structures or additional control line.png
5lanes_on_glass.PNG

Sheet Resistance

Metal Thickness

Electrical Anisotropy

Wet Coating Thickness and Residual Moisture

Resistivity Conductivity

EddyCus TF inline SR / Tool integrated - Non-contact Inline Sheet Resistance Monitoring Solution 

This non-contact sheet resistance monitoring system measures in high speed and non-contact the sheet resistance directly in manufacturing processes. Typical processes involve PVD, CVD, galvanic or conventional deposition processes on wafer, foils, paper, polymers or other substrates. In particular this processes include sputtering, evaporation, epitaxy or plating processes. Additionally, this also involves spraying, slot die coating or electronic printing processes. Furthermore, sheet resistance enhancing processes such as annealing and doping of thin-films or sintering of printed electronics benefit from inline monitoring of the electrical integrity. Oxidation, etching, polishing and also the impact of cleaning and drying processes are also part of the wide application range of this state of the art testing technique. The sheet resistance values are typically transferred to MES systems for quality assurance and particularly for process control.

Data Sheet for EddyCus® TF inline SR

Sheet resistance measurement technology Non-contact eddy current sensor
Substrates e.g. boules, ingots, wafer, foils, glass, etc.
Number of sensor pairs 1 – 99
Conductive layers Metals/ TCOs/ CNTs/ nanowires/ graphene/ grids/ other
Measurement gap size 1 / 5 / 10 / 15 / 25 / 50 mm (other on request)
Sheet resistance range

accuracy can be optimized over sheet resistance decade
within a customer specified range
0.0001 – 10 Ohm/sq; < 2 % accuracy
10 – 100 Ohm/sq; < 3 % accuracy
100 – 1,000 Ohm/sq; < 5 % accuracy
Thickness measurement of metal films (e.g. copper) 1 nm – 2 mm (in accordance with sheet resistance (cf. our calculator))
Environment Atmospheric / vacuum @ T < 60°C / 140°F (on request <90°C / 194°F)
Sample rate 1 / 10 / 50 / 100 / 1,000 measurement per second
Other integrated measurements Substrate thickness and temperature
Hardware trigger 5 / 12 / 24 V

 

Contact Us

You are welcome to contact our team for

  • Addressing questions
  • Request demo measurements
  • Request online or live demonstratons
  • Request quotations

CONTACT US

EddyCus TF inline MT / Tool integrated - Non-contact Inline Metal Thickness Monitoring Solution 

This non-contact metal thickness monitoring system provides immediate feedback for layer deposition and layer removal manufacturing processes. Typical deposition processes include sputtering, evaporation, plating or atomic layer deposition (ALD) eg. on wafer, foils, glass, ceramics (eg. PCT), paper, polymers or other substrates. Layer removal processes include polishing (CMP) or etching or laser scribing. The technical concept includes reflective and transmittive eddy current sensors and sensor setups. Additionally, a wide range of interface options are supported. 

Data Sheet for EddyCus® TF inline MT

Metal thickness measurement technology Non-contact eddy current sensor
Substrates e.g. foils, glass, etc.
Number of sensor pairs 1 – 99
Conductive layers Metals
Measurement gap size 1 / 5 / 10 / 15 / 25 / 50 mm (other on request)
Metal thickness range


accuracy can be optimized over sheet resistance decade
within a customer specified range
1 – 10 nm < 3 % accuracy
10 – 1,000 nm; < 3% accuracy
1 µm  – 100 µm < 3 % accuracy

Accuracies depend on the selected setup and the type of metal. Accuracies of 1% can be achieved in good setups eg. for Cu and Al
Parameter conversions Sheet resistance (cf. our calculator)
Environment Atmospheric / vacuum
Sample rate 1/ 10/ 50 /100 /1,000 / 25,000 measurements per second
Other integrated measurements Temperature (for integrated temperature drift compensation for long term measurements)
Hardware trigger 24 V (12 or 5 V on request)
 

Contact Us

You are welcome to contact our team for

  • Addressing questions
  • Request demo measurements
  • Request online or live demonstratons
  • Request quotations

CONTACT US

EddyCus TF inline SR-A / Tool integrated - Non-contact Inline Electrical Anisotropy Monitoring Solution 

The ability for non-destructive and non-contact inline measurement of electrical anisotropy is a unique capability of SURAGUS. The SR-A series induces currents in two or four directions and measures simultaneously the sheet resistance in different directions. The two direction mode is used for most inline applications. Here the machine direction is the known to be the dominant alignment direction for process reasons and flow of deposition material. If the dominant alignment direction of conductive material is not known, then the four sensor setup is applied. This sensor series is used for slot die or spray coating, screen printing or spinning processes. Typical materials are Silver nanowires, nanotubes or nanobuds, anisotropic meshes or structures or materials with anisotropic domain sizes or layer (stacks) with advanced current transport functions. The monitors are used to control isotropy or to achieve dedicated anisotropies where current transport is to be optimized in certain directions. In some case those systems are used to measure on structured materials or to identify defects.

Materials

  • Nanowires
  • Nanotubes / Nanobuds
  • Regular metal meshes
  • Materials with egg shaped domains
  • Stacked multilayer systems with advance current transport functions

Measurement Results

  • Absolute / relative anisotropy
  • Dominant current transport directions
  • Sheet resistance in machine direction
  • Sheet resistance in traversing directions (cross-web)

Data Sheet for EddyCus® TF inline SR-A

Anisotropy measurement technology Non-contact directed eddy current sensors (2 or 4)
Substrates Foils, glass, etc.
Number of sensor pairs 1 – 99 (typcial setups are 4 or 8 monitoring lanes)
Conductive layers Nanowires, CNTs, CNBs, Graphene, metal grids or others
Measurement gap size 20 / 35 / 50 mm (other on request)
Anisotropy measurment range (lowest / highest direction) 0.33 - 3 (0.1 - 10 on request)
Sheet resistance range

accuracy can be optimized over sheet resistance decade
within a customer specified range
0.01 – 10 Ohm/sq; < 2 % accuracy
10 – 100 Ohm/sq; < 3 % accuracy
100 – 1,000 Ohm/sq; < 5 % accuracy
Thickness measurement of metal films (e.g. copper) 1 nm – 2 mm (in accordance with sheet resistance (cf. our calculator))
Environment Atmospheric / vacuum
Sample rate 1/ 10/ 50 /100 measurements per second
Other integrated measurements Temperature
Hardware trigger 24 V (12 / 5 V)
 

Contact Us

You are welcome to contact our team for

  • Addressing questions
  • Request demo measurements
  • Request online or live demonstratons
  • Request quotations

CONTACT US

EddyCus TF inline HF Tool integrated - Non-contact Inline Wet Coating Thickness and Residual Moistor Monitoring Solution 

The HF series utilizes high frequency (HF) electromagnetic fields that interact with layers utilizing different effects. Those systems are used to analyse dielectrical and electric propeties. Applications include the measurements such as residual moisture and layer thicknesses of wet coatings. Processes include spray, slot die coating, curtain coating and many more wet depostion procecces. Addtionally drying and calandering processes can be controlled.

Testing Parameter

  • Residual Moisture
  • Material composition (condcutive vs dielectric vs magnetic elements)
  • Wet coating thickness

Data Sheet for EddyCus® TF inline HF

Measurement technology Non-contact high frequency eddy current sensor
Substrates Foils, glass, etc.
Number of sensor pairs 1 – 99
Conductive layers Inks with various compositions (eg. metals, solvents, water)
Measurement gap size 10 / 15 / 20 mm (other on request)
Measurement range 5 to 100 % residual moistor
10 to 2,000 µm wet coating thickness
Other applications Weight monitoring
Environment Atmospheric / vacuum / EX Zones
Sample rate 1 / 10 / 50 / 100 measurement per second
Other integrated measurements Temperature
Hardware trigger 24 V (12 / 5 V on request)

 

Contact Us

You are welcome to contact our team for

  • Addressing questions
  • Request demo measurements
  • Request online or live demonstratons
  • Request quotations

CONTACT US

EddyCus TF inline RM / Tool integrated - Non-contact Inline Resistivity and Conductivity Monitoring Solution 

The TF inline RM sensors measure the resistivity or conductivity or related parameters in automated handling or processing tools and manufacturing lines. Materials include semiconductors such as Si, SiC, GaAs, GaN, SiSiC and metals and alloys or other conductive materials. Applications in PV or semiconductor industry include wafer, boule or ingot characterization. Even further, temperature measurement of wafer, metals and metal sheets can be obtained by exploiting the correlation of temperature to resistivity. Bulk or volume materials are characterized with reflective mode sensors. Various penetration depth levels can be achieved by sensor and frequency variation. Further applications include integrity imaging of structured films or printed electronics on 3D shapes.

Materials

  • Semiconductor (Si, SiC, GaAs, GaN, SiSiC)
  • Metals and Alloys

Application:

  • Resistivity / Conductivity (Wafer, Boule, Puck level)
  • PN characterization
  • Temperature measurement of hot conducting materials (eg. Aluminium sheets)
  • Structure imaging
  • monitoring of laser removal processeing (mobile friendly glass, bird friendly glass)
  • Distance measurement to low and high conductive materials

Processes

  • Wafer quality monitoring by Float zone (FZ) and Czochralski growth (CZ) manufacturing
  • Semiconductor modification by implantation or annealing
  • PN junction manufacturing processes
  • Cooing and heating process monitoring

Sensor Setups

  • Reflection mode (one sensor element) for 2D and 3D shapes
  • Transmittance mode (two sensor elements) with known or measured material thickness

Data Sheet for EddyCus® TF inline RM

Resistivity measurement technology Eddy current sensor
Penetration depth 10 µm to 10 mm (depending on conductivity and measurement frequency 10 kHz to 50 MHz cf. technology page)
Spot size Various sensors are available. Coil size is 875 µm to 100 mm
Substrates Wafer, metals, alloys, ceramics, plastics etc.
Number of sensor 1 – 99
Materials Semiconductors, metals, alloys, conductive polymers, conductive ceramics
Measurement mode Single side reflection mode or transmittance mode with total thickness measurement
Resistivity range 0.1 mOhm cm - 5 ohm cm
Conductivity range (0.01 - 65 MS/ m)  (cf. our calculator))
Environment Atmospheric / vacuum
Sample rate 1/ 10/ 50 /100 /1,000 / 25,000 measurement per second
Other integrated measurements Total substrate thickness and temperature on request
Hardware trigger 24 V (12 / 5 V on request)

 

Contact Us

You are welcome to contact our team for

  • Addressing questions
  • Request demo measurements
  • Request online or live demonstratons
  • Request quotations

CONTACT US

SURAGUS Eddy Current Sensors

SURAGUS provides four types of sensors:

Choose the tab of your preferred sensor type below:

The S Sensor (small) is popular sensor type. It offers serveral mounting options that allow allow a quick modification of the sensor to substrate distance during installation. Furthermore it come in different versions for socket and mounting position that support a neat integration. 

Mounting

  • Top/bottom mounting
  • Vertical and horizontal

Size

  • Length 48 mm
  • Width 34 mm
  • Height 117 mm

Environment

  • Ex-vacuo
  • In-vacuo
  • ATEX on request

Picture Gallery of the Sensor S

SURAGUS Sensor S drawing.jpg
SURAGUS Sensor S overview drawing.jpg

Mounting

  • Top/bottom mounting
  • Vertical and horizontal

Size

  • Length 100 mm
  • Width 80 mm
  • Height 66 mm

Environment

  • Ex-vacuo
  • ATEX on request

Picture Gallery of the Sensor M

Ich würde hier echte photos verwenden, noch falscher sensor

Sensor_M_SURA-110-M-R07_tiny.jpg
Drawing_Sensor_M_SURA-110-M-R07.jpg

This sensor is eddy current operating in reflection mode.

SURAGUS Sensor XS reflection sensor_tiny.jpg
Drawing of Sensor XS - SURA-DD-105 .jpg

The Semi-Vacuum sensor is dedicate for vacuum tools with very limited space requirements.

Eddy Current Sensor S-SemiVac head_tiny.jpg
use_case_Eddy Current Sensor S-SemiVac_tiny2.jpg
Sensor_S-SemiVac_tiny2.jpg

Measurement Beams and Bridge Types

Requirements and Options for Measurement Bridges

  • In-vacuo / ex-vacuo
  • Fix or variable sensor positioning
  • Available space at place of integration
  • Freestanding autarkic measurement bridge vs. integrated solutions
  • Mounting opportunities to existing structure (conveyer belt, deposition chamber)

Types of Mounting Bridges

  • Beam integration
  • Frame integration
  • Conveyer integration
  • Free standing
  • Ultra Wide

Bridge Types in Vacuo

  • In-vacuo
  • n Sensor positions
  • Minimizes required space in tide machines
  • Effective cord wiring
  • Length and mounting plates are customized according available space and mounting points

Bridge Types Free Standing

  • Ex-vacuo
  • n Sensor positions
  • Electrical and mechanical independent

Software and Interfaces

Inline monitoring systems can be implemented into MES or other high level manufacturing software. SURAGUS offers independ sensor systems using comprehensive software.

  • Direct implementation of sensors using .Net libraries (documentation, project examples, sensor mockup are provided pre setup and test)
  • Data transmission via standardized protocols (e.g. Modbus) or TCP/IP based protocols
  • Data access via OPC by KEPServer with ODBC client
  • Analog or digital communication via I/O module(s), individual  parameterizable
  • Data access via database mapping
  • Additional solutions on request

SURAGUS provide three software solutions:

  1. The EC inline Control software is a self developed analysis tool
  2. The OEM and developer kits is a SDK and data post processing SDK that allows you to design a customized software for the specific needs accordung to your business
  3. Direct PLC integration to control the manufactoring process

    EC inline Control Software

    • Graphical live view (different time windows, from 1 minute to 24h)
    • Analysis view (data selection from database, statistics)
    • Sorting by time, distance, roll number, barcode or Data Matrix code.
    • Mode for extending and adapting the calibration
    • Parameterization dialog of I/O modules for analog and digital data transmission as well as the parameterization of alarms in case of over/underrun of threshold values
    • Automatic and manual data export (csv, txt, xls, ...)
    • Automatic database cleaning

    Software Developer Kits and Post Processing Kits

    Software Developer Kit - EC CU

    • EC CU SDK
      • EC CU Class Libraries (single files)
      • EC CU Class Libraries (nugget package)
      • Developer Documentation (html / chm)
      • User Manual
      • Sample Project – VS 2015 project 
      • Calibration and Calibration validation 
    • EC CU Emulator
      • Emulator App as Windows Installer
      • User Manual
    • EC CU Setup Tool 
      • Customizing of the processing pipe line
    • Trigger Modes
      • Free Running
      • Gate Mode (high / low)
      • Edge Mode (raising / falling)
      • One Measurement on High / Low

    SURAGUS Post Processing Library – EC PP

    Functions / Algorithms

    • Specimen recognition within data stream
      • Position of edges and center
      • Size
      • Value
      • Determination of minima and maxima (value, position) 
      • Determination of specimen length
    • References
      • Compensation of hardware variations and drift
        • SP, 1D, 2D
    • Edge-Effect-Compensation
      • Direct method
      • Reference method 
    • Further application specific functions

    Direct PLC Integration

    SURAGUS offers serveral hardware options for PLC integration incl. sensors with full digitalization at sensor level and direct PLC communicaton.

    Interfaces

    • Modbus
    • UDP
    • TCP XML
    • Profinet
    • OI module

    Trigger mode

    • Free Running
    • Gate Mode (high / low)
    • Edge Mode (raising / falling)
    • One Measurement on High / Low

    Other points

    • User and roll management

    Contact

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