Wafer Characterization

In seminconductor industry metal or metal oxide layers are applied for achieving electrical, mechanical, chemical, optical and a plethora of other characterisitcs. Properties such as sheet resistance, conductance, permeability or defectoscopy can be characterized by high frequency eddy current. Standard processes are vacuum processes such as evaporation, sputtering or atomic layer deposition (ALD) and wet processes such as plating. More over several different pre- and post-treatment processes are being used.

Testing

Sheet resistance
Resistivity
Thickness
Homogeneity
Permeability
Defectoscopy
Facette formation

Applications

Imaging & near edge monitoring
Wafer process Monitoring
Incoming inspection
Quality control
Deposition process control
Pre- and post-treatment process control

Substrates

Silicon
SiC
GaN
Sapphire (Al2O3)

Process

Wafer level
Batch systems
Load lock
Cluster systems
Inline

Environment

In-vacuo and ex-vacuo
In-situ and ex-situ
Inline and offline

Types

Power electronics
Industry electronics
IC
MEMS
Microelectronics
Microprocessor
LED
Sensors
Optics
5G

Further Resouces

SEMI MF673 — Test Method for Measuring Resistivity of Semiconductor Wafers or Sheet Resistance of Semiconductor Films with a Noncontact Eddy-Current Gauge
SEMI M59 — Terminology for Silicon Technology
SEMI MF81 — Test Method for Measuring Radial Resistivity Variation on Silicon Wafers
SEMI MF84 — Test Method for Measuring Resistivity of Silicon Wafers with an In-Line Four-Point Probe
SEMI MF374 — Test Method for Sheet Resistance of Silicon Epitaxial, Diffused, Polysilicon, and Ion-Implanted Layers Using an In-Line Four-Point Probe with the Single-Configuration Procedure
SEMI MF1527 — Guide for Application of Certified Reference Materials and Reference Wafers for Calibration and Control of Instruments for Measuring Resistivity of Silicon

For characterization of wafer processes in semiconductor industry SURAGUS refers to the following product categories: