EddyCus® TF map 2530 Series – Non-contact Sheet Resistance and Metal Layer Thickness Mapping Device

The Eddy­Cus® TF map 2530 Series auto­mat­ic­ally meas­ures the sheet res­ist­ance of large samples up to 300 x 300 mm² (12 x 12 inches) in non-con­tact mode. Upon manu­al sample po­s­i­tion­ing the device auto­mat­ic­ally meas­ures and dis­plays an ac­cur­ate map­ping of the sheet res­ist­ance across the en­tire sample area. The meas­ure­ment set­tings al­low eas­ily and flex­ibly to choose between fast meas­ure­ment times of be­low 1 minute or high spa­tial meas­ure­ment res­ol­u­tion of more than 100,000 meas­ure­ment points.

Highlights

  • Non-contact
  • Fast and precise measurement
  • High resolution mapping of conductive thin films
  • Imaging of substrates up to 300 x 300 mm (12 x 12 inches)
  • Characterization even of hidden and encapsulated conductive layers
  • Various software-integrated analysis functions (e.g. sheet resistance distribution, line scans, single point analysis)
  • Measurement data saving and export functions
  • Defect detection and coating analysis

Types

The device platform is available in different sensor configurations including eddy current sensors for electrical characterization or sensors for optical characterization. Variants of the measurement configurations involve the following options.

Combinations of the above variants are available as well (e.g. 2530SR-MT).

Characteristics

  • Technology: non-contact eddy current
  • Imaging by multipoint mapping
  • Positioning area: 300 mm x 300 mm
  • Sampling area: 300 x 300 mm
  • Recommended sample sizes: 1 inch to 12 inch or 25 to 300 mm  

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Software and Device Control

  • Very user-friendly software
  • Realtime mapping measurement
  • Easy-to-use statistical analysis options
  • Pre-defined measurement and product recipes (sizes, pitches, thresholds)
  • Line scan, histogram and area analysis
  • Black and colored image coding
  • Csv & pdf export
  • PC summary and export
  • 3 user level
  • Material database for parameter conversion
  • Edge effect compensation
  • Storage and import of data
  • Export of data sets (eg. to EddyEva, MS Excel, Origin)

Please select your preferred measurement parameter below

Sheet Resistance

Metal Thickness

Resistivity Conductivity

Electrical Anisotropy

Wet Coating Thickness and Residual Moisture

EddyCus® TF map 2530SR – Non-contact Sheet Resistance Imaging Device

The EddyCus® TF map 2530SR is a non-contact sheet resistance mapping system. The device is equipped with a travelling Eddy Current sensor that measures the sheet resistance on up to 90,000 (300 x 300) measurements points per scan. Since this technology does not require a physical contact to the specimen, the device takes measurements on the fly. Additionally, it excels with high accuracies as it is independent of any contact quality. The high density of measurement points across the sample ensures that no effects or defects are missed. Furthermore, the comprehensive analysis features support a systematic quality assurance of various thin-films in manufacturing and R&D laboratories. 

Software

Sheet Resistance Imaging of a Wafer with 360 OPS

Data Sheet for EddyCus® TF map 2530SR

Sheet resistance measurement technology Non-contact eddy current sensor
Substrates e.g. foils, glass, wafer, etc.
Substrate area 12 inch / 300 mm x 300 mm (larger on request)
Edge effect correction / exclusion 5 % edge exclusion for standard sizes
Max. sample thickness / sensor gap (defines distances) 1 / 2 / 5 / 10 / 25 mm (defined by the thickest sample / application)
Sheet resistance range

accuracy can be optimized over sheet resistance decade
within a customer specified range
0.0001 – 1 Ohm/sq; 2 to 3 % accuracy
1 – 1,000 Ohm/sq; 2 to 5 % accuracy
1,000 – 100,000 Ohm/sq; 3 to 5 % accuracy
Thickness measurement of metal films (e.g. copper) 1 nm – 2 mm (in accordance with sheet resistance (cf. our calculator))
Scanning pitch 1 / 2.5 / 5 / 10 mm (other on request)
Measurement points per time (quadratic shape) 100 measurement points in 0.5 minutes
10,000 measurement points in 5 minutes
1,000,000 measurement points in 30 minutes
Scanning time 4 inch / 100 mm x 100 mm in 0.5 to 5 minutes (1 – 10 mm pitch)
8 inch / 200 mm x 200 mm in 1.5 to 15 minutes ( 1 – 10 mm pitch)
Device dimension (w/h/d) 31,5 x 19.1 x 33.5 inch / 799 mm x 486 mm x 850 mm
Weight 90 kg
Available features Metal thickness imaging
Anisotropy sheet resistance sensor

 

Contact Us

You are welcome to contact our team for

  • Addressing questions
  • Request demo measurements
  • Request online or live demonstratons
  • Request quotations

CONTACT US

Picture Gallery of the EddyCus® TF map 2530SR

mapping of metal layer thickness and sheet resistance with the EddyCus® TF map 2530SR-MT
Eddycus® TF map 2530SR-MT metal layer thickness and sheet resistance mapping device
SURAGUS_EddyCus_map_2530SR_Front_with_software_clear_tiny.jpg
Metal layer thickness and sheet resistance mapper EddyCus® TF map 2530SR-MT
Metal layer thickness and sheet resistance mapping device EddyCus® TF map 2530SR-MT measures a wafer

Product Overview Sheet Resistance Measurement Systems

EddyCus® TF map 2530MT – Non-contact Metal Thickness Imaging Device

The EddyCus® TF map 2530MT is a non-contact thickness imaging system that operates independent from any optical properties. The device utilizes a non-contact eddy current sensor to determine the thickness of any material with known conductivity or characteristic conductivity profile such as metals or alloys. This non-contact testing technology enables a precise measurement in a wide thickness range starting at a few nanometer thickness reaching up to millimeter range. Additionally, it can also be applied to films that are encapsulated by non-conductive materials. The measurement method is very robust and excels with a high repeatability and high accuracy. Its independency from the optical characteristics is beneficial for various industries that deposit non-transparent metal film. This compact benchtop system is used for a wide range of application for quick tests or systematic quality assurance in manufacturing R&D and testing laboratories. 

Software

Metal Layer Thickness Imaging of a Wafer

Data Sheet for EddyCus® TF map 2530MT

Sheet resistance measurement technology Non-contact eddy current sensor
Substrates e.g. foils, glass, wafer, etc.
Substrate area 12 inch / 300 mm x 300 mm (larger on request)
Edge effect correction / exclusion 5 % edge exclusion for standard sizes
Max. sample thickness / sensor gap (defines distances) 1 / 2 / 5 / 10 / 25 mm (defined by the thickest sample / application)
Thickness measurement of metal films (e.g. copper)

accuracy can be optimized over sheet resistance decade
within a customer specified range
1 – 10 nm < 3 % accuracy
10 – 1,000 nm; < 3% accuracy
1 µm  – 100 µm < 3 % accuracy

Accuracies depend on the selected setup and the type of metal. Accuracies of 1% can be achieved in good setups eg. for Cu and Al
Sheet resistance range 0.1 mOhm/sq – 100,000 Ohm/sq
Scanning pitch 1 / 2.5 / 5 / 10 mm (other on request)
Measurement points per time (quadratic shape) 10,000 measurement points in 5 minutes
1,000,000 measurement points in 30 minutes
Scanning time 4 inch / 100 mm x 100 mm in 0.5 to 5 minutes (1 – 10 mm pitch)
8 inch / 200 mm x 200 mm in 1.5 to 15 minutes ( 1 – 10 mm pitch)
Device dimension (w/h/d) 31,5 x 19.3 x 33.5 inch / 800 mm x 490 mm x 850 mm
Available features Sheet resistance imaging
Anisotropy sheet resistance sensor

 

Contact Us

You are welcome to contact our team for

  • Addressing questions
  • Request demo measurements
  • Request online or live demonstratons
  • Request quotations

CONTACT US

Picture Gallery of the EddyCus® TF map 2530MT

mapping of metal layer thickness and sheet resistance with the EddyCus® TF map 2530SR-MT
Eddycus® TF map 2530SR-MT metal layer thickness and sheet resistance mapping device
SURAGUS_EddyCus_map_2530SR_Front_with_software_clear_tiny.jpg
Metal layer thickness and sheet resistance mapper EddyCus® TF map 2530SR-MT
Metal layer thickness and sheet resistance mapping device EddyCus® TF map 2530SR-MT measures a wafer

Product Overview Metal Thickness Testing Devices

EddyCus® TF map 2530RM – Conductivity Mapping and Defect Identification in Thin Films

A variety of materials characteristics determine the conductivity of materials. Next to its composition also its structure and its purity affect the conductivity. The Eddy­Cus® TF map 2530RM is an eddy current mapping system dedicated to high-resolution imaging of conductivity and correlated characteristics exposing material properties, effects and defects. The system can be equipped with various EddyCus sensors for conductivity imaging in high resolution or high penetration and defect detection by use of differential probes. The system supports the creation of images (Eddy Current C-Scans) of the surface with a measurement pitch of 100 µm to 10 mm. The three axis systems is capable to scan 2D and 2.5D areas with a size of up to 300 x 300 mm / 12 x 12 inch. Typical applications cover the surface characterization of conductive materials such as SiC-, Graphite-, metal, alloy or steel plates or other conductive semi-finished products. Additionally, the system can be used for testing the electrical integrity of printed electronics and layers.

Eddy current testing allows the quantification of material conductivity [IACS or MS/m] or resistivity [Ohm m or Ohm / mm² / m]. The conductivity of materials provides information on material characteristics such as type of material and homogeneity of the material composition. Next to the direct information on electrical properties, the conductivity also contains information that relate to its thermic properties or its mechanical properties and its structural integrity.

Specification

  • Measurement range : 0.01 – 65 MS/m (0.1 – 110 % IACS)
  • Specimen sizes : 5 x 5 mm to 300 x 300 mm
  • Shapes: flat and curved surfaces
  • Exchangeable sensors dedicated to specific measurement task
  • Customized specimen holder in terms of layout and shape in favor to specimen dimensions
  • Data analysis, export and reporting functions

Conductivity determination and conductivity imaging provides insights on:

  • Material types and material purities
  • Evaluation of material composition and composition variation
  • Impurities/ dotation
  • Variances in structure and structural integrity
  • Solidification behavior of casted materials
  • Conductivity-affected characteristics such as hardness, stress, grain boundaries and other characteristics

Software

Data Sheet for EddyCus® TF map 2530RM

Measurement technology Reflection sensor
Substrates Flat, slightly curved
Max. scanning area 300 mm x 300 mm x 10 mm
Edge effect correction / exclusion 5 % edge exclusion for standard sizes
Max. sample thickness / sensor gap (defines distances) 10 mm
Resistivity range 0.1 mOhm·cm - 5 ohm·cm
Conductivity range 0.01 – 65 MS/m
Min. pitch 0.1 mm
Mode Contact and non-contact
Speed 400 mm per second (time 1 to 30 minutes)
Device dimension (w/h/d) 31.5 x 19.1 x 33.5 inch / 799 x 486 x 850 mm / 90 kg
Weight 90 kg
Available features Sheet resistance imaging
Metal thickness imaging
Anisotropy sheet resistance sensor

 

Contact Us

You are welcome to contact our team for

  • Addressing questions
  • Request demo measurements
  • Request online or live demonstratons
  • Request quotations

CONTACT US

Picture Gallery of the EddyCus® TF map 2530RM

mapping of metal layer thickness and sheet resistance with the EddyCus® TF map 2530SR-MT
Eddycus® TF map 2530SR-MT metal layer thickness and sheet resistance mapping device
SURAGUS_EddyCus_map_2530SR_Front_with_software_clear_tiny.jpg
Metal layer thickness and sheet resistance mapper EddyCus® TF map 2530SR-MT
Metal layer thickness and sheet resistance mapping device EddyCus® TF map 2530SR-MT measures a wafer

EddyCus® TF map 2530A – Non-Contact Electrical Anisotropy and Sheet Resistance Imaging Device

The EddyCus® TF map 2530A (Anisotropy) is a unique anisotropy imaging system providing spatially resolved anisotropy images for profound understanding of the dominant orientation in wire structures. It utilized eddy current sensors that induce currents into defined directions. The resulting image shows the dominating wire direction, the anisotropy strength and the resulting sheet resistance. This unique tool is valuable for the characterization of wire structures such as Silver Nano Wires (Ag-NW), CNT, metal grids or nano-rod structures. Intentional anisotropic nanowires provide a better sheet resistance to optical transparency performance compared to isotropic nano-wire electrodes with opposite contact structure. This non-destructive testing method saves time and ensures that the wire deposition process provides the required orientation and resistance. This tool can be applied for quick quality checks or systematic quality assurance.

Terms and concept

  •  “Sheet resistance anisotropy” refers to a difference in electrical resistivity measured parallel and perpendicular (traverse) to the machine direction
  • Many wire and mesh structures can have an anisotropic sheet resistance

Electrical anisotropy…

  • …can be optimized according to the layout of the contact pattern
  • …can save material and improve optical transparency to sheet resistance ratio

 

Software

Metal Layer Thickness Imaging of a Wafer

Data Sheet for EddyCus® TF map 2530A

Sheet resistance measurement technology Non-contact eddy current sensor
Substrates e.g. foils, glass, etc.
≥ 25 mm x 25 mm
Max. scanning area 12 inch / 300 mm x 300 mm (larger on request)
Edge effect correction / exclusion 2 – 5 mm edge exclusion for standard sizes
Max. sample thickness / sensor gap (defines distances) 2 / 5 / 10 / 25 mm (defined by the thickest sample / application)
Sheet resistance range

accuracy can be optimized over sheet resistance decade
within a customer specified range
0.001 – 10 Ohm/sq; 2 to 7 % accuracy
0.01 – 1,000 Ohm/sq; 2 to 7 % accuracy
10 – 3,000 Ohm/sq; 2 to 7 % accuracy
Anisotropy range 0.33 – 3 (0.1 - 10 on request)
Thickness measurement of metal films (e.g. copper) 1 nm – 2 mm (in accordance with sheet resistance (cf. our calculator))
Scanning pitch 1 / 2.5 / 5 / 10 mm (other on request)
Measurement points per time (quadratic shape) 10,000 measurement points in 5 minutes
1,000,000 measurement points in 30 minutes
Scanning time 8 inch / 200 mm x 200 mm in 0.5 to 5 minutes (1 – 10 mm pitch)
12 inch / 300 mm x 300 mm in 1.5 to 15 minutes ( 1 – 10 mm pitch)
Device dimension (w/h/d) 31,5 x 19.1 x 33.5 inch / 799 mm x 486 mm x 850 mm
Weight 90 kg
Available features Metal thickness imaging
Sheet resistance measurement

 

Contact Us

You are welcome to contact our team for

  • Addressing questions
  • Request demo measurements
  • Request online or live demonstratons
  • Request quotations

CONTACT US

Picture Gallery of the EddyCus® TF lab 2530A

mapping of metal layer thickness and sheet resistance with the EddyCus® TF map 2530SR-MT
Eddycus® TF map 2530SR-MT metal layer thickness and sheet resistance mapping device
SURAGUS_EddyCus_map_2530SR_Front_with_software_clear_tiny.jpg
Metal layer thickness and sheet resistance mapper EddyCus® TF map 2530SR-MT
Metal layer thickness and sheet resistance mapping device EddyCus® TF map 2530SR-MT measures a wafer

Product Overview Electrical Anisotropy and Sheet Resistance Measurement Systems

EddyCus® TF map 2530HF – Wet Coating Thickness and Residual Moisture

The EddyCus® TF map 2530HF is a high frequency eddy current mapping device designed for material and thin-film characterization. The device is sensitive to characteristics that correlate with electric, dielectric and magnetic properties. Typical applications include the assessment of material composition, the measurement of residual moisture, wet coating thickness or permittivity, and the determination of the content level of conductive (e.g. C, Pt) or magnetic (e.g. Co) materials. SURAGUS also supports complex impedance analysis to derive information on electrical, dielectric or magnetic properties from hybrid materials with a single measurement. The exact capabilities regarding specific measurement tasks can be provided from a consultation with the SURAGUS team.

Software and Device Control

  • Pre-defined measurement and product recipes (sizes, pitches, thresholds)
  • Line scan, histogram and area analysis
  • Black and colored image coding
  • Csv & pdf export
  • PC summary and export
  • 3 user level
  • Material database for parameter conversion
  • Edge effect compensation
  • Storage and import of data
  • Export of data sets (eg. to EddyEva, MS Excel, Origin)

Data Sheet for EddyCus® TF map 2530HF

Measurement technology Reflection sensor
Substrates Flat, slightly curved
Max. scanning area 300 mm x 300 mm x 10 mm
Edge effect correction / exclusion 5 % edge exclusion for standard sizes
Max. sample thickness / sensor gap (defines distances) 10 mm
Resistivity range 0.1 mOhm·cm - 5 ohm·cm
Conductivity range 0.01 – 65 MS/m
Min. pitch 0.1 mm
Mode Contact and non-contact
Speed 400 mm per second (time 1 to 30 minutes)
Device dimension (w/h/d) 31.5 x 19.1 x 33.5 inch / 799 x 486 x 850 mm / 90 kg
Weight 90 kg
Available features Sheet resistance imaging
Metal thickness imaging
Anisotropy sheet resistance sensor

 

Contact Us

You are welcome to contact our team for

  • Addressing questions
  • Request demo measurements
  • Request online or live demonstratons
  • Request quotations

CONTACT US

Picture Gallery of the EddyCus® TF map 2530HF

mapping of metal layer thickness and sheet resistance with the EddyCus® TF map 2530SR-MT
Eddycus® TF map 2530SR-MT metal layer thickness and sheet resistance mapping device
SURAGUS_EddyCus_map_2530SR_Front_with_software_clear_tiny.jpg
Metal layer thickness and sheet resistance mapper EddyCus® TF map 2530SR-MT
Metal layer thickness and sheet resistance mapping device EddyCus® TF map 2530SR-MT measures a wafer

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