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The EddyCus TF inline series measures layer properties such as metal layer thickness, sheet resistance, emissivity, residual moisture or grammage in non-contact on various substrates. Relevant substrates are glass, foil, paper, wafer, plastic or ceramic. Monitoring is done by permanent measurement or by trigger events to obtain equidistant results in fast moving coating processes. Monitoring solutions can be implemented either in atmosphere or vacuum conditions. Processes using eddy current technology benefit from high samples rates. Measurement results can be provided for process control systems using customer´s software. Additionally SURAGUS offers the monitoring software EddyCus EC Control that visualizes, stores and analyses metrology data.
SURAGUS offers inline and offline testing systems to support the achievement of those goals.
This non-contact sheet resistance monitoring system measures in high speed and non-contact the sheet resistance directly in manufacturing processes. Typical processes involve PVD, CVD, galvanic or conventional deposition processes on wafer, foils, paper, polymers or other substrates. In particular this processes include sputtering, evaporation, epitaxy or plating processes. Additionally, this also involves spraying, slot die coating or electronic printing processes. Furthermore, sheet resistance enhancing processes such as annealing and doping of thin-films or sintering of printed electronics benefit from inline monitoring of the electrical integrity. Oxidation, etching, polishing and also the impact of cleaning and drying processes are also part of the wide application range of this state of the art testing technique. The sheet resistance values are typically transferred to MES systems for quality assurance and particularly for process control.
Sheet resistance measurement technology | Non-contact eddy current sensor |
Substrates | e.g. boules, ingots, wafer, foils, glass, etc. |
Number of sensor pairs | 1 – 99 |
Conductive layers | Metals/ TCOs/ CNTs/ nanowires/ graphene/ grids/ other |
Measurement gap size | 1 / 5 / 10 / 15 / 25 / 50 mm (other on request) |
Sheet resistance range accuracy can be optimized over sheet resistance decade within a customer specified range |
0.0001 – 10 Ohm/sq; < 2 % accuracy 10 – 100 Ohm/sq; < 3 % accuracy 100 – 1,000 Ohm/sq; < 5 % accuracy |
Thickness measurement of metal films (e.g. copper) | 1 nm – 2 mm (in accordance with sheet resistance (cf. our calculator)) |
Environment | Atmospheric / vacuum @ T < 60°C / 140°F (on request <90°C / 194°F) |
Sample rate | 1 / 10 / 50 / 100 / 1,000 measurement per second |
Other integrated measurements | Substrate thickness and temperature |
Hardware trigger | 5 / 12 / 24 V |
You are welcome to contact our team for
This non-contact metal thickness monitoring system provides immediate feedback for layer deposition and layer removal manufacturing processes. Typical deposition processes include sputtering, evaporation, plating or atomic layer deposition (ALD) eg. on wafer, foils, glass, ceramics (eg. PCT), paper, polymers or other substrates. Layer removal processes include polishing (CMP) or etching or laser scribing. The technical concept includes reflective and transmittive eddy current sensors and sensor setups. Additionally, a wide range of interface options are supported.
Metal thickness measurement technology | Non-contact eddy current sensor |
Substrates | e.g. foils, glass, etc. |
Number of sensor pairs | 1 – 99 |
Conductive layers | Metals |
Measurement gap size | 1 / 5 / 10 / 15 / 25 / 50 mm (other on request) |
Metal thickness range accuracy can be optimized over sheet resistance decade within a customer specified range |
1 – 10 nm < 3 % accuracy 10 – 1,000 nm; < 3% accuracy 1 µm – 100 µm < 3 % accuracy Accuracies depend on the selected setup and the type of metal. Accuracies of 1% can be achieved in good setups eg. for Cu and Al |
Parameter conversions | Sheet resistance (cf. our calculator) |
Environment | Atmospheric / vacuum |
Sample rate | 1/ 10/ 50 /100 /1,000 / 25,000 measurements per second |
Other integrated measurements | Temperature (for integrated temperature drift compensation for long term measurements) |
Hardware trigger | 24 V (12 or 5 V on request) |
You are welcome to contact our team for
The ability for non-destructive and non-contact inline measurement of electrical anisotropy is a unique capability of SURAGUS. The inline A series induces currents in two or four directions and measures simultaneously the sheet resistance in different directions. The two direction mode is used for most inline applications. Here the machine direction is the known to be the dominant alignment direction for process reasons and flow of deposition material. If the dominant alignment direction of conductive material is not known, then the four sensor setup is applied. This sensor series is used for slot die or spray coating, screen printing or spinning processes. Typical materials are Silver nanowires, nanotubes or nanobuds, anisotropic meshes or structures or materials with anisotropic domain sizes or layer (stacks) with advanced current transport functions. The monitors are used to control isotropy or to achieve dedicated anisotropies where current transport is to be optimized in certain directions. In some case those systems are used to measure on structured materials or to identify defects.
Anisotropy measurement technology | Non-contact directed eddy current sensors (2 or 4) |
Substrates | Foils, glass, etc. |
Number of sensor pairs | 1 – 99 (typcial setups are 4 or 8 monitoring lanes) |
Conductive layers | Nanowires, CNTs, CNBs, Graphene, metal grids or others |
Measurement gap size | 20 / 35 / 50 mm (other on request) |
Anisotropy measurment range (lowest / highest direction) | 0.33 - 3 (0.1 - 10 on request) |
Sheet resistance range accuracy can be optimized over sheet resistance decade within a customer specified range |
0.01 – 10 Ohm/sq; < 2 % accuracy 10 – 100 Ohm/sq; < 3 % accuracy 100 – 1,000 Ohm/sq; < 5 % accuracy |
Thickness measurement of metal films (e.g. copper) | 1 nm – 2 mm (in accordance with sheet resistance (cf. our calculator)) |
Environment | Atmospheric / vacuum |
Sample rate | 1/ 10/ 50 /100 measurements per second |
Other integrated measurements | Temperature |
Hardware trigger | 24 V (12 / 5 V) |
You are welcome to contact our team for
The HF series utilizes high frequency (HF) electromagnetic fields that interact with layers utilizing different effects. Those systems are used to analyse dielectrical and electric propeties. Applications include the measurements such as residual moisture and layer thicknesses of wet coatings. Processes include spray, slot die coating, curtain coating and many more wet depostion procecces. Addtionally drying and calandering processes can be controlled.
Measurement technology | Non-contact high frequency eddy current sensor |
Substrates | Foils, glass, etc. |
Number of sensor pairs | 1 – 99 |
Conductive layers | Inks with various compositions (eg. metals, solvents, water) |
Measurement gap size | 10 / 15 / 20 mm (other on request) |
Measurement range | 5 to 100 % residual moistor 10 to 2,000 µm wet coating thickness |
Other applications | Weight monitoring |
Environment | Atmospheric / vacuum / EX Zones |
Sample rate | 1 / 10 / 50 / 100 measurement per second |
Other integrated measurements | Temperature |
Hardware trigger | 24 V (12 / 5 V on request) |
You are welcome to contact our team for
The TF inline RM sensors measure the resistivity or conductivity or related parameters in automated handling or processing tools and manufacturing lines. Materials include semiconductors such as Si, SiC, GaAs, GaN, SiSiC and metals and alloys or other conductive materials. Applications in PV or semiconductor industry include wafer, boule or ingot characterization. Even further, temperature measurement of wafer, metals and metal sheets can be obtained by exploiting the correlation of temperature to resistivity. Bulk or volume materials are characterized with reflective mode sensors. Various penetration depth levels can be achieved by sensor and frequency variation. Further applications include integrity imaging of structured films or printed electronics on 3D shapes.
Resistivity measurement technology | Eddy current sensor |
Penetration depth | 10 µm to 10 mm (depending on conductivity and measurement frequency 10 kHz to 50 MHz cf. technology page) |
Spot size | Various sensors are available. Coil size is 875 µm to 100 mm |
Substrates | Wafer, metals, alloys, ceramics, plastics etc. |
Number of sensor | 1 – 99 |
Materials | Semiconductors, metals, alloys, conductive polymers, conductive ceramics |
Measurement mode | Single side reflection mode or transmittance mode with total thickness measurement |
Resistivity range | 0.1 mOhm cm - 5 ohm cm |
Conductivity range | (0.01 - 65 MS/ m) (cf. our calculator)) |
Environment | Atmospheric / vacuum |
Sample rate | 1/ 10/ 50 /100 /1,000 / 25,000 measurement per second |
Other integrated measurements | Total substrate thickness and temperature on request |
Hardware trigger | 24 V (12 / 5 V on request) |
You are welcome to contact our team for
SURAGUS provides four types of sensors:
The S Sensor (small) is popular sensor type. It offers serveral mounting options that allow allow a quick modification of the sensor to substrate distance during installation. Furthermore it come in different versions for socket and mounting position that support a neat integration.
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Inline monitoring systems can be implemented into MES or other high level manufacturing software. SURAGUS offers independ sensor systems using comprehensive software.
SURAGUS provide three software solutions:
Functions / Algorithms
SURAGUS offers serveral hardware options for PLC integration incl. sensors with full digitalization at sensor level and direct PLC communicaton.
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