For product requests contact us by using the
- Contact formular,
- Email (sales@suragus.com) or
- Phone (+49 351 32 111 520).
EddyCus® TF inline - Non-contact Sheet Resistance, Layer Thickness and Electrical Anisotropy Measurement Solutions for Process Control
The EddyCus TF inline series measures layer properties such as metal layer thickness, sheet resistance, emissivity, residual moisture or grammage in non-contact on various substrates. Relevant substrates are glass, foil, paper, wafer, plastic or ceramic. Monitoring is done by permanent measurement or by trigger events to obtain equidistant results in fast moving coating processes. Monitoring solutions can be implemented either in atmosphere or vacuum conditions. Processes using eddy current technology benefit from high samples rates. Measurement results can be provided for process control systems using customer´s software. Additionally SURAGUS offers the monitoring software EddyCus EC Control that visualizes, stores and analyses metrology data.
Non-contact Inline Sheet Resistance Measurement using Eddy Currents
Advantages
- Non-contact real time measurement
- High measurement speed up to 1,000 measurements/ sec.
- Fixed sensor installation or traversing sensor installation
- Integration of 1 – 99 monitoring lanes per system
- Process control at atmosphere or in vacuum
- Measurements very close to the edge of the substrate are possible in many applications
- Long term stability by temperature compensated measurements in changing environment
- Large distances to the testing material (e.g. gap of 60 mm / 2.4 inch)
- Characterization of covered conductive layers or encapsulated substrates
- Numerous software integrated analysis and statistic functions
- Easy set up by EddyCus RampUp software incl. wizard for system calibration
- Wear- free
Motivation for the Use of Inline Metrology
- Process control and quality assurance
- Process time optimization
- Machine utilization
- Material usage
- Productivity
- Product performance improvement (e.g. high transparency and low resistivity, good emissivity, good barrier properties)
- Layer homogeneity especially across large substrates widths
- Predictive maintenance
Sensor Types
- EddyCus TF inline SR – Sheet resistance monitoring (incl. emissivity)
PDF (2.0 MB)
- EddyCus TF inline MT – Metal thickness monitoring
PDF (670.0 KB)
- EddyCus TF inline RM – Resistivity and conductivity monitoring
PDF (395.9 KB)
- EddyCus TF inline HF – Residual moisture monitoring
PDF (447.2 KB)
- EddyCus TF inline A – Sheet resistance and electrical anisotropy monitoring
PDF (626.4 KB)
Measurement Ranges
- Sheet resistance: 0.1 mOhm/sq up to 1 kOhm/sq
- Metal thickness: 2 nm – 2 mm (depending material conductivity)
- Resistivity: 0.1 mOhm cm – 5 ohm cm
- Residual moisture (measurement in wet layers by non-contact permittivity measurement)
- Electrical anisotropy: 0.33 to 3 (higher on request)
- Correlating properties
- Grammage: 0.1 to 1,000 g/sqm
- Emissivity: 0.005 to 0.2
Applications
- Architectural glass (LowE)
- Packaging materials
- Displays and touch screens
- Photovoltaics (Thin-film and c-Si)
- Mirror coatings
- Capacitors
- OLEDs and LEDs
- Smart glass
- Metal layers and wafer metallization
- De-icing and heating
- Batteries and fuel cells
- Coated paper and conductive textiles
- Graphene layers
- Antibacterial coatings
Setups
- Inline R2R
- Inline S2S
- Cluster tools
- Integration into handling areas
- Transmission and reflection setups
Processes
- Deposition (PVD, ALD, (PE)CVD, electroplating, printing, spraying etc.)
- Ablation/ structuring (etching, polishing, laser etc.)
- Doping/ Implantation
- Tempering/ Annealing
- Drying/ Heating
SURAGUS offers inline and offline testing systems to support the achievement of those goals.
Sensor Form Factors (All Measurement Types)
- Sensor S (many options)
- Sensor S - Semi-Vac (vacuum only)
- Sensor M
- Sensor XS
- Customized forms (multi sensors)
Interfaces
- TCP, UDP
- Modbus
- CSV, XML
- Analog, digital
- Profinet
Environment
- Atmosphere
- Vacuum
- ATEX
- High temperature version on request
Wiring Setups
- Control cabinet mounting near sensor positions
- Direct mounting tool mounting near sensor positions
- Full sensor integrated hardware
 |
 |
 |
 |
 |
EddyCus TF inline SR / Tool integrated - Non-contact Inline Sheet Resistance Monitoring Solution
This non-contact sheet resistance monitoring system measures in high speed and non-contact the sheet resistance directly in manufacturing processes. Typical processes involve PVD, CVD, galvanic or conventional deposition processes on wafer, foils, paper, polymers or other substrates. In particular these processes include sputtering, evaporation, epitaxy or plating processes. Additionally, this also involves spraying, slot die coating or electronic printing processes. Furthermore, sheet resistance enhancing processes such as annealing and doping of thin-films or sintering of printed electronics benefit from inline monitoring of the electrical integrity. Oxidation, etching, polishing and also the impact of cleaning and drying processes are also part of the wide application range of this state of the art testing technique. The sheet resistance values are typically transferred to MES systems for quality assurance and particularly for process control.
Data Sheet for EddyCus® TF inline SR
| Measurement technology | Non-contact eddy current sensor |
| Substrates | Boules, ingots, wafer, foils, glass, etc. |
| Measurement gap size | 3 / 5 / 10 / 15 / 25 / 50 mm (other upon request) |
| Number of sensor pairs / monitoring lanes | 1 – 99 |
| Sensor sizes (W x L x H) in mm | Sensor M: 80 x 100 x 66 Sensor S: 34 x 48 x 117 |
| Conductive layers | Metals/ TCOs/ CNTs/ nanowires/ graphene/ grids/ PEDOT/ others |
| Thickness measurement of metal films (e.g. Al, Ag, Mo, Ag paste) | 1 nm – 2 mm (in accordance with sheet resistance) (cf. our calculator) |
| Other integrated measurements | Metal thickness / optical transmittance / density / anisotropy |
| Environment | Ex-vacuo / in-vacuo @ T < 60°C / 140°F (higher on request) |
| Sample rate | 1 / 10 / 50 / 100 / 1,000 measurements per second |
| Hardware trigger | 5 / 12 / 24 V |
| Interfaces | UDP, .Net libraries, TCP, Modbus, analog/digital |
| VLSR | LSR | MSR | HSR | VHSR | |
|---|---|---|---|---|---|
| 6 decades are measurable by one sensor, but with slightly affected accuracy | |||||
| Range [Ohm/sq] | 0.0001 – 0.1 | 0.01 – 10 | 0.1 – 100 | 10 – 2,000 | 1,000 – 200,000 |
| Accuracy / Bias | ± 1% | ± 1 – 3% | ± 1% | ||
| Repeatability (2σ) | < 0.3% | < 0.5% | < 0.3% | ||
| VLSR – Very Low Sheet Resistance , LSR – Low Sheet Resistance , MSR – Medium Sheet Resistance , HSR – High Sheet Resistance , VHSR – Very High Sheet Resistance | |||||
Contact Us
You are welcome to contact our team for
- Addressing questions
- Request demo measurements
- Request online or live demonstrations
- Request quotations
Download Data Sheet
EddyCus TF inline MT / Tool integrated - Non-contact Inline Metal Thickness Monitoring Solution
This non-contact metal thickness monitoring system provides immediate feedback for layer deposition and layer removal manufacturing processes. Typical deposition processes include sputtering, evaporation, plating or atomic layer deposition (ALD) e.g. on wafer, foils, glass, ceramics (e.g. PCT), paper, polymers or other substrates. Layer removal processes include polishing (CMP) or etching or laser scribing. The technical concept includes reflective and transmission eddy current sensors and sensor setups. Additionally, a wide range of interface options are supported.
Data Sheet for EddyCus® TF inline MT
| Measurement technology | Non-contact eddy current sensor |
| Substrates | Foil, glass, wafer, etc. |
| Measurement gap size | 3 / 5 / 10 / 15 / 25 / 50 mm (other upon request) |
| Number of monitoring lanes | 1 – 99 |
| Sensor sizes (W x L x H) in mm | Sensor M: 80 x 100 x 66 Sensor S: 34 x 48 x 117 |
| Conductive layers | Metals |
| Metal thickness range Accuracies depend on the selected setup and the type / conductivity of the metal (e.g. copper, aluminum, silver) |
Low 1 – 10 nm; 2 – 5 % accuracy Standard 10 – 1,000 nm; 1 – 3 % accuracy High 1 – 100 µm; 0.5 – 3 % accuracy |
| Metal thickness calibration | Direct thickness calibration / sheet resistance conversion |
| Other integrated measurements | Ex-vacuo / in-vacuo @ T < 60°C / 140°F (higher upon request) |
| Environment | Temperature (for integrated temperature drift compensation for long term measurements) |
| Sample rate | 1 / 10 / 50 / 100 / 1,000 measurements/s (25,000 Hz upon request) |
| Hardware trigger | 24 V (5 or 12 V upon request) |
| Interfaces | UDP, TCP, .Net libraries, Modbus, Profinet, analog/digital, CSV, XML, other |
| Further available features / other tool configurations | Sheet resistance measurement / conductivity / resistivity / anisotropy / emissivity / permeability (beta) |
Contact Us
You are welcome to contact our team for
- Addressing questions
- Request demo measurements
- Request online or live demonstrations
- Request quotations
Download Data Sheet
EddyCus TF inline A / Tool integrated – Non-contact Inline Electrical Anisotropy Monitoring Solution
The ability for non-destructive and non-contact inline measurement of electrical anisotropy is a unique capability of SURAGUS. The inline A series induces currents in two or four directions and measures simultaneously the sheet resistance in different directions. The two-direction mode is used for most inline applications. Here the machine direction is the known to be the dominant alignment direction for process reasons and flow of deposition material. If the dominant alignment direction of conductive material is not known, then the four-sensor setup is applied. This sensor series is used for slot die or spray coating, screen printing or spinning processes. Typical materials are Silver nanowires, nanotubes or nanobuds, anisotropic meshes or structures or materials with anisotropic domain sizes or layer (stacks) with advanced current transport functions. The monitors are used to control isotropy or to achieve dedicated anisotropies where current transport is to be optimized in certain directions. In some case those systems are used to measure on structured materials or to identify defects.
Materials
- Nanowires
- Nanotubes / Nanobuds
- Regular metal meshes
- Materials with egg shaped domains
- Stacked multilayer systems with advance current transport functions
Measurement Results
- Absolute / relative anisotropy
- Dominant current transport directions
- Sheet resistance in machine direction
- Sheet resistance in traversing directions (cross-web)
Data Sheet for EddyCus® TF inline A
| Measurement technology | Non-contact eddy current sensors with directed current induction |
| Substrates | Foils, glass, wafer, etc. |
| Measurement gap size | 5 / 10 / 15 / 25 / 50 / 75 mm |
| Number of sensor pairs / monitoring lanes | 1 – 99 |
| Sensor sizes (W x L x H) in mm | Sensor M: 80 x 100 x 66 Sensor S: 34 x 48 x 117 |
| Sheet resistance range | 0.01 – 1,000 Ohm/sq; 1 to 5 % accuracy |
| Anisotropy range (TD/MD) | 0.33 – 3 (larger upon request) |
| Environment | Ex-vacuo/ in-vacuo @ T < 60°C / 140°F (higher upon request) |
| Sample rate | 1 / 10 / 50 / 100 / 1,000 measurements per second |
| Hardware trigger | 5 / 12 / 24 V |
| Interfaces | UDP, .Net libraries, TCP, Modbus, analog/digital |
| Further available features | Metal thickness, optical transmittance and reflectance (OEM) |
Contact Us
You are welcome to contact our team for
- Addressing questions
- Request demo measurements
- Request online or live demonstrations
- Request quotations
Download Data Sheet
EddyCus TF inline HF / Tool integrated - Non-contact Inline Wet Coating Thickness and Residual Moisture Monitoring Solution
The HF series utilizes high frequency (HF) electromagnetic fields that interact with layers utilizing different effects. Those systems are used to analyze dielectrical and electric properties. Applications include the measurements such as residual moisture and layer thicknesses of wet coatings. Processes include spray, slot die coating, curtain coating and many more wet deposition processes. Additionally drying and calendaring processes can be controlled.
Testing Parameter
- Residual Moisture
- Material composition (conductive vs dielectric vs magnetic elements)
- Wet coating thickness
Data Sheet for EddyCus® TF inline HF
| Measurement technology | Non-contact high frequency eddy current sensor |
| Substrates | Foils, glass, pipes, various containers and transport items |
| Max. sample thickness/ sensor gap | Transmission setup: 3 – 50 mm (defined by the thickest sample) Reflection setups: infitive (only surface area is analyzed) |
| Number of sensor pairs / monitoring lanes | 1 – 99 |
| Sensor sizes (W x L x H) in mm | Sensor M: 80 x 100 x 66 Sensor S: 34 x 48 x 117 |
| Measurement types | Wet thickness (µm) / weight (g/m²) / drying status (%) / conductivity (MS/m) / resistivity (mOhm cm) / permeability (H/m) Beta / permittivity (F/m) Beta |
| Measurement range / accuracy | Depends on the measurement task and the material composition and test object volume. Please consult with the SURAGUS team |
| Further available measurements | Sheet resistance, metal thickness, anisotropy, optical transparency, reflection, haze |
| Environment | Ex-vacuo In-vacuo ATEX on request T < 60°C (higher upon request) |
| Sample rate | 1 / 10 / 50 / 100 / 1,000 measurements per second |
| Hardware trigger | 5 / 12 / 24 V |
| Interfaces | UDP, .Net libraries, TCP, Modbus, analog/digital |
Contact Us
You are welcome to contact our team for
- Addressing questions
- Request demo measurements
- Request online or live demonstrations
- Request quotations
Download Data Sheet
EddyCus TF inline RM / Tool integrated - Non-contact Inline Resistivity and Conductivity Monitoring Solution
The TF inline RM sensors measure the resistivity or conductivity or related parameters in automated handling or processing tools and manufacturing lines. Materials include semiconductors such as Si, SiC, GaAs, GaN, SiSiC and metals and alloys or other conductive materials. Applications in PV or semiconductor industry include wafer, boule or ingot characterization. Even further, temperature measurement of wafer, metals and metal sheets can be obtained by exploiting the correlation of temperature to resistivity. Bulk or volume materials are characterized with reflective mode sensors. Various penetration depth levels can be achieved by sensor and frequency variation. Further applications include integrity imaging of structured films or printed electronics on 3D shapes.
Materials
- Semiconductor (Si, SiC, GaAs, GaN, SiSiC)
- Metals and Alloys
Application:
- Resistivity / Conductivity (Wafer, Boule, Puck level)
- PN characterization
- Temperature measurement of hot conducting materials (e.g. Aluminium sheets)
- Structure imaging
- monitoring of laser removal processing (mobile friendly glass, bird friendly glass)
- Distance measurement to low and high conductive materials
Processes
- Wafer quality monitoring by Float zone (FZ) and Czochralski growth (CZ) manufacturing
- Semiconductor modification by implantation or annealing
- PN junction manufacturing processes
- Cooing and heating process monitoring
Sensor Setups
- Reflection mode (one sensor element) for 2D and 3D shapes
- Transmittance mode (two sensor elements) with known or measured material thickness
Data Sheet for EddyCus® TF inline RM
| Measurement technology | High frequency eddy current sensor |
| Penetration depth | 10 µm to 10 mm (depending on conductivity and measurement frequency 10 kHz to 50 MHz cf. technology page) |
| Spot size | Various sensors are available. Coil size is 875 µm to 100 mm |
| Substrates | Wafer, metals, alloys, ceramics, plastics etc. |
| Measurement gap size | 5 / 10 / 15 / 25 / 50 / 75 mm |
| Number of sensor | 1 – 99 |
| Sensor sizes (W x L x H) in mm | Sensor M: 80 x 100 x 66 Sensor S: 34 x 48 x 117 |
| Materials | Semiconductors, metals, alloys, conductive polymers, conductive ceramics |
| Measurement mode | Single side reflection mode or transmittance mode with total thickness measurement |
| Conductive layers | Metals/ TCOs/ CNTs/ nanowires/ graphene/ grids/ PEDOT/ others |
| Resistivity range | 0.1 – 5,000 mOhm·cm |
| Conductivity range | 0.01 – 65 MS/m () |
| Environment | Ex-vacuo/ in-vacuo @ T < 60°C / 140°F (higher upon request) |
| Sample rate | 1 / 10 / 50 / 100 / 1,000 measurements per second |
| Other integrated measurements | Metal thickness / optical transmittance / density / anisotropy |
| Hardware trigger | 5 / 12 / 24 V |
| Interfaces | UDP, .Net libraries, TCP, Modbus, analog/digital |
Contact Us
You are welcome to contact our team for
- Addressing questions
- Request demo measurements
- Request online or live demonstrations
- Request quotations
Download Data Sheet
SURAGUS Eddy Current Sensors
SURAGUS provides four types of sensors:
Choose the tab of your preferred sensor type below:
The S Sensor (small) is popular sensor type. It offers several mounting options that allow a quick modification of the sensor to substrate distance during installation. Furthermore, it come in different versions for socket and mounting position that support a neat integration.
Mounting
- Top/bottom mounting
- Vertical and horizontal
Size
- Length 48 mm
- Width 34 mm
- Height 117 mm
Environment
- Ex-vacuo
- In-vacuo
- ATEX on request
Picture Gallery of the Sensor S
 |  |
Mounting
- Top/bottom mounting
- Vertical and horizontal
Size
- Length 100 mm
- Width 80 mm
- Height 66 mm
Environment
- Ex-vacuo
- ATEX on request
Picture Gallery of the Sensor M
 |  |
This sensor is eddy current operating in reflection mode.
 |  |
The Semi-Vacuum sensor is dedicate for vacuum tools with very limited space requirements.
 |  |  |
Measurement Beams and Bridge Types
Requirements and Options for Measurement Bridges
- In-vacuo / ex-vacuo
- Fix or variable sensor positioning
- Available space at place of integration
- Freestanding autarkic measurement bridge vs. integrated solutions
- Mounting opportunities to existing structure (conveyer belt, deposition chamber)
Types of Mounting Bridges
- Beam integration
- Frame integration
- Conveyer integration
- Free standing
- Ultra Wide
Bridge Types in Vacuo
- In-vacuo
- n Sensor positions
- Minimizes required space in tide machines
- Effective cord wiring
- Length and mounting plates are customized according available space and mounting points
Bridge Types Free Standing
- Ex-vacuo
- n Sensor positions
- Electrical and mechanical independent
Software and Interfaces
Inline monitoring systems can be implemented into MES or other high level manufacturing software. SURAGUS offers independ sensor systems using comprehensive software.
- Direct implementation of sensors using .Net libraries (documentation, project examples, sensor mockup are provided pre setup and test)
- Data transmission via standardized protocols (e.g. Modbus) or TCP/IP based protocols
- Data access via OPC by KEPServer with ODBC client
- Analog or digital communication via I/O module(s), individual parameterizable
- Data access via database mapping
- Additional solutions on request
SURAGUS provide three software solutions:
- The EC inline Control software is a self developed analysis tool
- The OEM and developer kits is a SDK and data post processing SDK that allows you to design a customized software for the specific needs accordung to your business
- Direct PLC integration to control the manufactoring process
EC inline Control Software
- Graphical live view (different time windows, from 1 minute to 24h)
- Analysis view (data selection from database, statistics)
- Sorting by time, distance, roll number, barcode or Data Matrix code.
- Mode for extending and adapting the calibration
- Parameterization dialog of I/O modules for analog and digital data transmission as well as the parameterization of alarms in case of over/underrun of threshold values
- Automatic and manual data export (csv, txt, xls, ...)
- Automatic database cleaning
Software Developer Kits and Post Processing Kits
Software Developer Kit - EC CU
- EC CU SDK
- EC CU Class Libraries (single files)
- EC CU Class Libraries (nugget package)
- Developer Documentation (html / chm)
- User Manual
- Sample Project – VS 2015 project
- Calibration and Calibration validation
- EC CU Emulator
- Emulator App as Windows Installer
- User Manual
- EC CU Setup Tool
- Customizing of the processing pipe line
- Trigger Modes
- Free Running
- Gate Mode (high / low)
- Edge Mode (raising / falling)
- One Measurement on High / Low
SURAGUS Post Processing Library – EC PP
Functions / Algorithms
- Specimen recognition within data stream
- Position of edges and center
- Size
- Value
- Determination of minima and maxima (value, position)
- Determination of specimen length
- References
- Compensation of hardware variations and drift
- SP, 1D, 2D
- Compensation of hardware variations and drift
- Edge-Effect-Compensation
- Direct method
- Reference method
- Further application specific functions
Direct PLC Integration
SURAGUS offers serveral hardware options for PLC integration incl. sensors with full digitalization at sensor level and direct PLC communicaton.
Interfaces
- Modbus
- UDP
- TCP XML
- Profinet
- OI module
Trigger mode
- Free Running
- Gate Mode (high / low)
- Edge Mode (raising / falling)
- One Measurement on High / Low
Other points
- User and roll management
