Wafer and Panel Level Packaging

Due to cost pressure in the semiconductor industry wafer or panel level packaging is a method of packaging an integreted circuit (IC) directly on the wafer or panel. It has large potential for further miniaturization, both in volume and in thickness. For high-troughput requirements high frequency eddy current technology characterizes sheet resistance, conductivity, thickness and homogeneity of metal layers.

Testing

• Sheet resistance
• Conductivity
• Thickness
• Homogeneity

Substrate types

• Wafer
• Glass
• Plastics (molded compounds)

Common substrate sizes

• Wafer level
  • 2 inch to 8 inch
• Panel level
  • 410 mm x 515 mm
  • 510 mm x 515 mm
  • 500 mm x 500 mm
  • 600 mm x 600 mm
  • 650 mm x 650 mm

Typical layers

• Ti
• Cu

Processes

• Plating
• Sputtering

Further resources

• SEMI MF673 — Test Method for Measuring Resistivity of Semiconductor Wafers or Sheet Resistance of Semiconductor Films with a Noncontact Eddy-Current Gauge
• SEMI M59 — Terminology for Silicon Technology
• SEMI MF81 — Test Method for Measuring Radial Resistivity Variation on Silicon Wafers
• SEMI MF84 — Test Method for Measuring Resistivity of Silicon Wafers with an In-Line Four-Point Probe
• SEMI MF374 — Test Method for Sheet Resistance of Silicon Epitaxial, Diffused, Polysilicon, and Ion-Implanted Layers Using an In-Line Four-Point Probe with the Single-Configuration Procedure
• SEMI MF1527 — Guide for Application of Certified Reference Materials and Reference Wafers for Calibration and Control of Instruments for Measuring Resistivity of Silicon